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FC-PGA Last modified: Wednesday, January 15, 2003
Acronym for flip chip pin grid array. FC-PGA packages use chips that have been turned upside down and attached to the package or the board using solder balls instead of perimeter bonding wires. The solder balls are jointed directly to a set of solder balls on the substrate (the base layer of the chip and the electrical ground for the circuit). The exposed core rests on the actual package, and the chips make direct contact with the heat sink. This allows for more efficient cooling to take place. Since the chips are placed directly on the board, FC-PGA packages have a high I/O density and shorter electrical connections than other types of packaging. Compare to PPGA and PGA.
Intel Packaging Databook  Data reference guide to Intel package selection and availability. Flip Chip Packages Go Mainstream Flip-chip packaging technology is moving out of its high-end niche and into the mainstream IC market. The FC-PGA Celerons Sharkyextreme.com looks at the way FC-PGA packages have affected Intel's Celeron processor. Hardware Central Detailed test reports on the latest desktop and laptop computers. Plus news on trend-setting products just coming into the pipeline.	Related Categories Hardware Microprocessors Motherboards Related Terms chip DIP fab fabless PGA PPGA silicon SIP socket 370